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lmv331 single lmv393 dual lmv339 quad www.ti.com slcs136s ? august 1999 ? revised october 2012 general-purpose low-voltage comparators 1 features ? 2.7-v and 5-v performance ? low supply current ? lmv331 . . . 130 a typ ? lmv393 . . . 210 a typ ? lmv339 . . . 410 a typ ? input common-mode voltage range includes ground ? low output saturation voltage 200 mv typical ? open-collector output for maximum flexibility description/ ordering information the lmv393 and lmv339 devices are low-voltage (2.7 v to 5.5 v) versions of the dual and quad comparators, lm393 and lm339, which operate from 5 v to 30 v. the lmv331 is the single-comparator version. the lmv331, lmv339, and lmv393 are the most cost-effective solutions for applications where low- voltage operation, low power, space saving, and price are the primary specifications in circuit design for portable consumer products. these devices offer specifications that meet or exceed the familiar lm339 and lm393 devices at a fraction of the supply current. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 1999 ? 2012, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 12 3 4 5 6 7 1413 12 11 10 98 2out 1out 1inC v cc+ 1in+ 2inC 2in+ 3out 3inC 4in+ gnd 4inC 3in+ 4out lmv339 . . . d or pw package (top view) lmv393 . . . d, ddu, dgk or pw package (top view) 12 3 4 87 6 5 1out 1inC 1in+ gnd v cc+ 2out 2inC 2in+ lmv331 . . . dbv or dck package (top view) v cc+ out 12 3 54 1in+ gnd 1inC lmv339 . . . ruc package (top view) 1 2 3 4 5 12 11 10 98 7 6 14 13 1out 1inC v cc+ 1in+ 2inC 2in+ 3inC 4in+ gnd 4inC 3in+ 4out 3out 2out
lmv331 single lmv393 dual lmv339 quad slcs136s ? august 1999 ? revised october 2012 www.ti.com ordering information (1) top-side t a package (2) orderable part number marking (3) reel of 3000 lmv331idckr sc-70 ? dck r2_ reel of 250 lmv331idckt single reel of 3000 lmv331idbvr sot23-5 ? dbv r1i_ reel of 250 lmv331idbvt msop/vssop ? dgk reel of 2500 lmv393idgkr r9_ tube of 75 lmv393id soic ? d mv393i reel of 2500 lmv393idr dual ? 40 c to 125 c tube of 90 lmv393ipw tssop ? pw mv393i reel of 2000 lmv393ipwr vssop ? ddu reel of 3000 lmv393iddur rabr tube of 50 lmv339id soic ? d lm339i reel of 2500 lmv339idr quad tube of 150 lmv339ipw tssop ? pw mv339i reel of 2000 lmv339ipwr qfn ? ruc reel of 3000 lmv339irucr rt_ (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at www.ti.com . (2) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (3) dbv/dck/dgk/ruc : the actual top-side marking has one additional character that designates the wafer fab/assembly site. symbol (each comparator) simplified schematic 2 submit documentation feedback copyright ? 1999 ? 2012, texas instruments incorporated in+ in? out gnd r1 q1 q3 q7 q6 v cc+ q2 q4 q5 r2 r3 q8 q9 + ? in? in+ out
lmv331 single lmv393 dual lmv339 quad www.ti.com slcs136s ? august 1999 ? revised october 2012 absolute maximum ratings (1) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage (2) 5.5 v v id differential input voltage (3) 5.5 v v i input voltage range (either input) 0 v cc+ v at or below t a = 25 c, duration of output short circuit (one amplifier) to ground (4) unlimited v cc 5.5 v 8 pin 97 d package 14 pin 86 dbv package 206 dck package 252 ja package thermal impedance (5) (6) ddu package 210 c/w ruc package 216 dgk package 172 8 pin 149 pw package 14 pin 113 t j operating virtual junction temperature 150 c t stg storage temperature range ? 65 150 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values (except differential voltages and v cc specified for the measurement of i os ) are with respect to the network gnd. (3) differential voltages are at in+ with respect to in ? . (4) short circuits from outputs to v cc can cause excessive heating and eventual destruction. (5) maximum power dissipation is a function of t j (max), ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ ja . operating at the absolute maximum t j of 150 c can affect reliability. (6) the package thermal impedance is calculated in accordance with jesd 51-7. recommended operating conditions min max unit v cc supply voltage (single-supply operation) 2.7 5.5 v v cc+ + v out output voltage v 0.3 t a operating free-air temperature i temperature ? 40 125 c copyright ? 1999 ? 2012, texas instruments incorporated submit documentation feedback 3
lmv331 single lmv393 dual lmv339 quad slcs136s ? august 1999 ? revised october 2012 www.ti.com electrical characteristics v cc+ = 2.7 v, gnd = 0 v, at specified free-air temperature (unless otherwise noted) parameter test conditions t a min typ max unit v io input offset voltage 25 c 1.7 7 mv average temperature ? 40 c to vio coefficient of input offset 5 v/ c 125 c voltage 25 c 15 250 i ib input bias current na ? 40 c to 400 125 c 25 c 5 50 i io input offset current na ? 40 c to 150 125 c i o output current (sinking) v o 1.5 v 25 c 5 23 ma 25 c 0.003 output leakage current a ? 40 c to 1 125 c common-mode input v icr 25 c ? 0.1 to 2 v voltage range v sat saturation voltage i o 1.5 ma 25 c 200 mv lmv331 25 c 40 100 i cc supply current lmv393 (both comparators) 25 c 70 140 a lmv339 (all four comparators) 25 c 140 200 switching characteristics t a = 25 c, v cc+ = 2.7 v, r l = 5.1 k , gnd = 0 v (unless otherwise noted) parameter test conditions typ unit input overdrive = 10 mv 1000 propagation delay high to low level output t phl ns switching input overdrive = 100 mv 350 input overdrive = 10 mv 500 propagation delay low to high level output t plh ns switching input overdrive = 100 mv 400 4 submit documentation feedback copyright ? 1999 ? 2012, texas instruments incorporated
lmv331 single lmv393 dual lmv339 quad www.ti.com slcs136s ? august 1999 ? revised october 2012 electrical characteristics v cc+ = 5 v, gnd = 0 v, at specified free-air temperature (unless otherwise noted) parameter test conditions t a min typ max unit 25 c 1.7 7 v io input offset voltage mv ? 40 c to 9 125 c average temperature vio coefficient of input offset 25 c 5 v/ c voltage 25 c 25 250 i ib input bias current na ? 40 c to 400 125 c 25 c 2 50 i io input offset current na ? 40 c to 150 125 c i o output current (sinking) v o 1.5 v 25 c 10 84 ma 25 c 0.003 output leakage current a ? 40 c to 1 125 c common-mode input v icr 25 c ? 0.1 to 4.2 v voltage range large-signal differential a vd 25 c 20 50 v/mv voltage gain 25 c 200 400 v sat saturation voltage i o 4 ma mv ? 40 c to 700 125 c 25 c 60 120 lmv331 ? 40 c to 150 125 c 25 c 100 200 i cc supply current lmv393 (both comparators) a ? 40 c to 250 125 c 25 c 170 300 lmv339 (all four comparators) ? 40 c to 350 125 c switching characteristics t a = 25 c, v cc+ = 5 v, r l = 5.1 k , gnd = 0 v (unless otherwise noted) parameter test conditions typ unit input overdrive = 10 mv 600 propagation delay high to low level output t phl ns switching input overdrive = 100 mv 200 input overdrive = 10 mv 450 propagation delay low to high level output t plh ns switching input overdrive = 100 mv 300 copyright ? 1999 ? 2012, texas instruments incorporated submit documentation feedback 5
lmv331 single lmv393 dual lmv339 quad slcs136s ? august 1999 ? revised october 2012 www.ti.com revision history changes from revision m (november 2005) to revision n page ? changed document format from quicksilver to doczone. .................................................................................................... 1 ? added ruc package pin out and ruc package ordering information. ............................................................................... 1 changes from revision n (april 2011) to revision o page ? changed v i in the absolute maximum ratings from 5.5 v to v cc+ ...................................................................................... 3 changes from revision o (february 2012) to revision p page ? updated ordering information table for top side marking, r9_. ........................................................................................ 2 changes from revision p (march 2012) to revision q page ? updated the top side marking for ruc package, rt_. ...................................................................................................... 2 changes from revision q (april 2012) to revision r page ? added ruc to marking list ................................................................................................................................................... 2 changes from revision r (may 2012) to revision s page ? updated operating temperature range .............................................................................................................................. 2 ? added thermal impedance data ............................................................................................................................................ 3 6 submit documentation feedback copyright ? 1999 ? 2012, texas instruments incorporated
package option addendum www.ti.com 18-oct-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lmv331idbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r1i2 ~ r1ic ~ r1ii) lmv331idbvre4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r1i2 ~ r1ic ~ r1ii) lmv331idbvrg4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r1i2 ~ r1ic ~ r1ii) lmv331idbvt active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r1i2 ~ r1ic ~ r1ii) lmv331idbvte4 active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r1i2 ~ r1ic ~ r1ii) lmv331idbvtg4 active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r1i2 ~ r1ic ~ r1ii) lmv331idckr active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r2c ~ r2i ~ r2r) lmv331idckre4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r2c ~ r2i ~ r2r) lmv331idckrg4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r2c ~ r2i ~ r2r) lmv331idckt active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r2c ~ r2i ~ r2r) lmv331idckte4 active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r2c ~ r2i ~ r2r) lmv331idcktg4 active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r2c ~ r2i ~ r2r) lmv339id active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 lmv339i lmv339ide4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 lmv339i lmv339idg4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 lmv339i lmv339idr active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 lmv339i lmv339idre4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 lmv339i
package option addendum www.ti.com 18-oct-2013 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lmv339idrg4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 lmv339i lmv339ipw active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv339i lmv339ipwe4 active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv339i lmv339ipwg4 active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv339i lmv339ipwr active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv339i lmv339ipwre4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv339i lmv339ipwrg4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv339i lmv339irucr active qfn ruc 14 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 rt lmv393id active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393iddur active vssop ddu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 rabr lmv393iddure4 active vssop ddu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 rabr lmv393iddurg4 active vssop ddu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 rabr lmv393ide4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393idg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393idgkr active vssop dgk 8 2500 green (rohs & no sb/br) cu nipdau | cu nipdauag level-1-260c-unlim -40 to 125 (r9b ~ r9q ~ r9r) lmv393idgkrg4 active vssop dgk 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 (r9b ~ r9q ~ r9r) lmv393idr active soic d 8 2500 green (rohs & no sb/br) cu nipdau | cu sn level-1-260c-unlim -40 to 125 mv393i lmv393idre4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i
package option addendum www.ti.com 18-oct-2013 addendum-page 3 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lmv393idrg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393ipw active tssop pw 8 150 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393ipwe4 active tssop pw 8 150 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393ipwg4 active tssop pw 8 150 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393ipwr active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393ipwre4 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i lmv393ipwrg4 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 mv393i (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 18-oct-2013 addendum-page 4 (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of lmv331, lmv393 : ? automotive: lmv331-q1 , lmv393-q1 note: qualified version definitions: ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lmv331idbvr sot-23 dbv 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 q3 lmv331idbvr sot-23 dbv 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 q3 lmv331idbvt sot-23 dbv 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 q3 lmv331idbvt sot-23 dbv 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 q3 lmv331idckr sc70 dck 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 q3 lmv331idckr sc70 dck 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 q3 lmv331idckt sc70 dck 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 q3 lmv331idckt sc70 dck 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 q3 lmv339idr soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 lmv339ipwr tssop pw 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 lmv339irucr qfn ruc 14 3000 180.0 8.4 2.3 2.3 0.55 4.0 8.0 q2 lmv393iddur vssop ddu 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 q3 lmv393idgkr vssop dgk 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 q1 lmv393idr soic d 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 q1 lmv393idr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 lmv393idrg4 soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 lmv393ipwr tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 package materials information www.ti.com 15-oct-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) lmv331idbvr sot-23 dbv 5 3000 180.0 180.0 18.0 lmv331idbvr sot-23 dbv 5 3000 205.0 200.0 33.0 lmv331idbvt sot-23 dbv 5 250 205.0 200.0 33.0 lmv331idbvt sot-23 dbv 5 250 180.0 180.0 18.0 lmv331idckr sc70 dck 5 3000 205.0 200.0 33.0 lmv331idckr sc70 dck 5 3000 180.0 180.0 18.0 lmv331idckt sc70 dck 5 250 180.0 180.0 18.0 lmv331idckt sc70 dck 5 250 205.0 200.0 33.0 lmv339idr soic d 14 2500 367.0 367.0 38.0 lmv339ipwr tssop pw 14 2000 367.0 367.0 35.0 lmv339irucr qfn ruc 14 3000 202.0 201.0 28.0 lmv393iddur vssop ddu 8 3000 202.0 201.0 28.0 lmv393idgkr vssop dgk 8 2500 364.0 364.0 27.0 lmv393idr soic d 8 2500 364.0 364.0 27.0 lmv393idr soic d 8 2500 340.5 338.1 20.6 lmv393idrg4 soic d 8 2500 340.5 338.1 20.6 lmv393ipwr tssop pw 8 2000 367.0 367.0 35.0 package materials information www.ti.com 15-oct-2013 pack materials-page 2

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mouser electronics authorized distributor click to view pricing, inventory, delivery & lifecycle information: texas instruments: ? lmv331idckr? lmv339ipwr? lmv393idgkr? lmv393idr? lmv339idr? lmv339ipw? lmv331idbvr? lmv393ipwr? lmv331idbvre4? lmv331idbvrg4? lmv331idbvt? lmv331idbvte4? lmv331idckre4? lmv331idckrg4? lmv331idckt? lmv331idckte4? lmv339id? lmv339ide4? lmv339idre4? lmv339ipwe4? lmv339ipwre4? lmv393id? lmv393iddur? lmv393iddure4? lmv393ide4? lmv393idgkrg4? lmv393idre4? lmv393ipw? lmv393ipwe4? lmv393ipwre4? lmv393ipwrg4? lmv393iddurg4? lmv331idcktg4? lmv339idg4? lmv339idrg4? lmv339ipwg4? lmv339ipwrg4? lmv393idg4? lmv393idrg4? lmv393ipwg4? lmv331idbvtg4? lmv339irucr

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